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Applied Materials convened experts from IBM, imec, Intel, and Samsung to discuss advancements in process control.
April 21, 2025
By: DAVID SAVASTANO
Editor, Ink World Magazine
As AI drives demand for advanced logic and memory technologies, the chipmaking roadmap is becoming more complex – opening the door to a growing number of defects that can dramatically impact chip performance and yield. During the 2025 SPIE Advanced Lithography + Patterning conference, Applied Materials convened experts from IBM, imec, Intel, and Samsung to discuss how advancements in process control can help address emerging defectivity challenges in the “angstrom era.” Electron beam (eBea...
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